JISHNU KISHOR CK
MOHAMMED NAFEES LATHIF 
NINJUL SAJEEVKUMAR
PARVAN AC

Efcient heat dissipation is one of the most critical aspects in maintaining the
performance, reliability, and longevity of electronic components. As electronic devices
continue to become more compact and powerful, the demand for effective cooling
solutions has increased significantly. Among various cooling techniques, air-cooled
heat sinks are widely used due to their simple design, ease of manufacturing, and low
Cost. However, their thermal performance is often constrained by limitations in in
geometry, material selection, and air flow distribution. Therefore, enhancing the thermal
performance of air-cooled heat sinks has become a major area of research in modern
thermal management systems.

This project focuses on improving the thermal eficiency of air-cooled heat sinks
through opimization of fin geometry, material configuration, and forced air flow.
Diferent fin shapes such as rectangular, trapezoidal, and pin fins were analyzed to
evaluate their effect on heat transfer rate, surface temperature, and thermal resistance.
A hybrid material combination using a copper base with aluminum fins was also
investigated to utilize the high thermal conductivity of copper while maintaining
lightweight characteristics of aluminum. Computational and experimental analyses were
performed to study the temperature distribution and air flow behavior under different
operating conditions.

The results revealed that the optimized beat sink configuration significantly reduces
the junction temperature of the electronic component and improves the overall heat
transfer efficiency compared to conventional designs. The findings demonstrate that by
employing proper fin geometry, hybrid materials, and effective air circulation, the thermal
performance of air-cooled heat sinks can be enhanced substantially. This study contributes
to the development of compact, reliable, and energy-efficient cooling solutions for modern
electronic systems.